Samsung is gearing up for a significant change in its High Bandwidth Memory (HBM) business next year. The company is on track to achieve HBM4 qualification, aligning its timeline with major competitors. This progress positions Samsung to make a substantial impact in the market.
Samsung’s HBM4: A Promising Contender
Industry reports suggest that Samsung’s HBM initiatives have encountered challenges, including initial DRAM and thermal issues. However, the company has reworked its 1c DRAM technology to boost confidence in external adoption. Sources indicate that Samsung’s HBM4 solution is set to receive approval from NVIDIA by year’s end, marking a pivotal milestone.
According to industry sources on Thursday, Samsung has completed production readiness approval for its HBM4 chips — considered the final internal hurdle before mass production. As the company is currently supplying HBM4 samples to major customers for quality testing, analysts expect the chips could clear final verification as early as this month.
Samsung’s HBM4 is poised to make a significant mark due to its competitive pricing and exceptional pin speeds of 11 Gbps, touted as the fastest available. This strategy, combined with advancements in 1c DRAM technology and a 4nm base die, is anticipated to support strong yield rates, enhancing Samsung’s appeal to major clients like NVIDIA.
Strategic Alliances and Market Outlook
NVIDIA’s strategy to diversify its supply chain and secure ample DRAM capacity underscores the importance of Samsung’s inclusion as an HBM partner. For Samsung, the partnership holds potential for revitalizing its DRAM business, which has faced challenging quarters. The company remains optimistic, seeing interest not only from NVIDIA and AMD, but also from tech giants like Google, Meta, and Amazon, who are engaged in the ASIC race.