The tech world is buzzing as AMD announces the introduction of its latest 800-series chipsets for the AM5 motherboard platform. These new additions are set to invigorate the market with exciting features and enhanced performance options. With the launch of the Ryzen 7000, 8000, and 9000 series CPUs, AMD is now rolling out the X870 and B850 chipsets, designed to appeal to both high-end enthusiasts and mainstream users. These innovations promise to captivate new builders and those looking to upgrade from the AM4 platform.
Unveiling the AMD AM5 Platform
Three years after the AMD AM5 motherboard entered the scene, the platform continues to evolve, boasting the introduction of the X870 and B850 chipsets. These new chipsets feature redesigned architectures and cutting-edge technologies that bring meaningful upgrades, such as improved I/O memory support and enhanced overclocking capabilities. These advancements are particularly beneficial for Ryzen CPUs, including the Zen 5-based Ryzen 9000 “Granite Ridge” family.
The X870E and X870 motherboards stand out with the inclusion of USB 4.0 and PCIe Gen5 for graphics and NVME, along with new PBO and CO algorithms for Ryzen 9000 CPUs. Meanwhile, the B850 and B840 chipsets cater to the mainstream market, offering comprehensive support and affordability that challenge Intel’s offerings.
AMD Chipset Features and Specifications
A closer look at the chipset offerings reveals a series of promising features. The X870E chipset utilizes two Promontory 21 dies, guaranteeing robust USB4 and Gen5 GPU/SSD support. In contrast, the X870 chipset uses a single die while still maintaining strong I/O capabilities.
| Chipset | X870E | X870 | X670E/X670 | B650E/B650 | A620 |
|---|---|---|---|---|---|
| CrossfireX/SLI | 2-Way CFX | 2-Way CFX | 2-Way CFX | 2-Way CFX | N/A |
| CPU Lanes (Usable) | 24 Gen 5 (with Ryzen 7000 CPUs & above) | 24 Gen 5 (with Ryzen 7000 CPUs & above) | 24 Gen 5 (with Ryzen 7000 CPUs & above) | 24 Gen 5 (with Ryzen 7000 CPUs & above) 24 Gen 4 for B650 |
24 Gen 4 (with Ryzen 7000 CPUs & above) |
| PCH Lanes (Usable) | 8 Gen4 12 Gen3 |
4 Gen4 8 Gen3 |
12 Gen4 8 Gen3 |
8 Gen4 4 Gen3 |
8 Gen 3 |
| USB4 | Standard | Standard | Optional | Optional | Optional |
| USB 3.1/3.2 Gen2 | 2 | 1 | 2 | 1 | 0 |
| USB 3.1/3.2 Gen1 | 12 | 6 | 12 | 6 | 2 |
| USB 2.0 | 8 | 8 | 8 | 6 | 6 |
| SATA 6Gb/s | 8 | 8 | 8 | 4 | 4 |
| DDR5 DIMMs | 4 | 4 | 4 | 4 | 4 |
| DDR4 DIMMs | N/A | N/A | N/A | N/A | N/A |
| Overclocking Support |
Yes | Yes | Yes | Yes | N/A |
| XFR2 Enhanced | Yes | Yes | Yes | Yes | N/A |
| Precision Boost Overdrive | Yes | Yes | Yes | Yes | N/A |
| NVMe | Yes (Gen 5.0) | Yes (Gen 5.0) | Yes (Gen 5.0) | Yes (Gen 5.0) | N/A |
| Form Factor | ATX/ITX | ATX/mATX/ITX | ATX/mATX/ITX | ATX/mATX/ITX | mATX/ITX |
The lineup includes the affordable B840 chipset, which retains the older Promontory 19 die and offers basic Gen4 support for GPUs and SSDs. In contrast, the B850 brings the newer Promontory 21 die with options for Gen5 support, making it a competitive entry in the market.
Anticipating the Future with the LGA 1718 Socket
The transition from the AM4 to AM5 socket is marked by the introduction of the LGA 1718 design. This new layout supports enhanced communication channels, offering more connectivity options for modern CPUs. AMD has committed to supporting the AM5 socket until at least 2027, promising consumers longevity and continued innovation.
In terms of cooler compatibility, the new Ryzen 7000, 8000, and 9000 CPUs maintain the same dimensions as existing models, ensuring that current cooling solutions will work seamlessly. This forward-thinking approach ensures that builders can upgrade without the need for additional investments in cooling technology.
Stay tuned for more updates as AMD continues to revolutionize its motherboard and chipset offerings.