Intel has been a key player in advanced packaging solutions, offering competitive options that stand out in the tech industry. While the company may have fallen behind in the chip business, its technological advancements in packaging are gaining attention from major firms.
Intel’s Advanced Packaging Technologies Gain Ground
Recent developments in high-performance computing have heightened demand for powerful compute solutions, pushing the industry beyond the improvements of Moore’s Law. Companies such as AMD and NVIDIA have embraced advanced packaging, which integrates multiple chips into a single package, enhancing both chip density and platform performance. This sector has long been led by TSMC, but changes are on the horizon.
Industry Shows Interest in Intel’s EMIB and Foveros
Job listings from companies like Qualcomm and Apple indicate a growing interest in Intel’s EMIB technology. Apple is on the lookout for a DRAM packaging engineer experienced in technologies such as CoWoS, EMIB, SoIC, and PoP. Similarly, Qualcomm seeks a Director of Product Management for its Data Center Business Unit who is familiar with EMIB. This interest reflects the industry’s keen attention toward Intel’s offerings.
Intel offers innovative packaging technologies like EMIB (Embedded Multi-Die Interconnect Bridge), which connects multiple chiplets within a package without the need for a large interposer, and Foveros Direct 3D packaging that allows for stacking on a base die. These solutions are becoming increasingly favored in the industry for their efficiency and performance.
Intel’s Opportunity Amid Industry Challenges
The current supply constraints faced by TSMC, due to high demand from tech giants such as NVIDIA and AMD, have opened a window for Intel. Companies like Apple, Qualcomm, and Broadcom, eager to advance in custom silicon, see Intel’s solutions as attractive alternatives.
NVIDIA’s CEO Jensen Huang’s positive remarks about Intel’s Foveros technology underscore the potential for Intel to expand its influence in the advanced packaging space. Although job postings do not guarantee adoption, they highlight the industry’s genuine interest in Intel’s offerings.
